# CVE-2025-27039

## Summary

- **CVE ID:** CVE-2025-27039
- **Severity:** MEDIUM
- **CVSS Score:** 6.6 (CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:L/I:L/A:H)
- **CWE:** CWE-390
- **Published:** Oct 9, 2025
- **Last Modified:** Mar 13, 2026

## Description

Memory corruption may occur while processing IOCTL call for DMM/WARPNCC CONFIG request.

## Affected Products

- Qualcomm, Inc. — Snapdragon (FastConnect 6900)
- Qualcomm, Inc. — Snapdragon (FastConnect 7800)
- Qualcomm, Inc. — Snapdragon (SXR2230P)
- Qualcomm, Inc. — Snapdragon (SXR2250P)
- Qualcomm, Inc. — Snapdragon (WCD9380)
- Qualcomm, Inc. — Snapdragon (WCD9385)
- Qualcomm, Inc. — Snapdragon (WSA8830)
- Qualcomm, Inc. — Snapdragon (WSA8832)
- Qualcomm, Inc. — Snapdragon (WSA8835)

## References

- [CNA](https://docs.qualcomm.com/product/publicresources/securitybulletin/october-2025-bulletin.html)

## Exploitation Prediction (EPSS)

- **EPSS Score:** 0.08%
- **EPSS Percentile:** 0.1

---
_Exported from OnDuty AI Vulnerability Intelligence on 2026-09-11._